From Atoms to Devices: SCACS, Bridging the Longstanding Scale Gap in Heat Transport SCACS (Simulator Collection for Atomic-to-Continuum Scales) is a first-of-its-kind simulation framework that connects atomic-scale material structure directly to device-scale predictions of heat flow. This solves a longstanding problem in science and engineering: how to use atomic-level information to predict the behavior of real materials and devices. Statistical mechanics is a classic example of linking microscopic physics to large-scale properties such as temperature and pressure. In a similar spirit, SCACS links atomic, mesoscopic, and macroscopic descriptions of thermal transport in a continuous and practical way. The method starts from atomistic information, preserves the effects of defects, interfaces, and disorder, and transfers that information into engineering-scale heat-flow simulations. A machine-learning model is used as a computational tool to extend these predictions to much larger systems than would otherwise be practical. The result is a new route for carrying atomic-scale thermal physics into device-scale models, with potential value for designing semiconductors, energy materials, and other technologies where heat management is critical.