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Boosting Seebeck coefficient through electron-phonon interaction by phonon frequency control

Asumi Michibata1, Tsukasa Terada1, Kotaro Matsuzono1, Takafumi Ishibe1, Yuichiro Yamashita2, Nobuyasu Naruse3, Katsuhiro Suzuki4, and Yoshiaki Nakamura1,*

  • *Contact author: nakamura.yoshiaki.es@osaka-u.ac.jp

Phys. Rev. Materials 10, 043401 – Published 3 April, 2026

DOI: https://doi.org/10.1103/lc66-t2m8

Abstract

In Dirac and Weyl semimetals with a flat band, the Seebeck coefficient (S) can be enhanced by the energy filtering effect in wave number space through electron-phonon interaction (EPI). Especially, topological B20-type semimetal thin films are promising materials because their Dirac or Weyl fermions are robust against defect scattering, making EPI dominant carrier scattering in the thin films. Here, we propose a strategy of raising this EPI-induced S enhancement effect (ESE) by enhancing EPI at room temperature (RT) via phonon frequency control. By using two atoms with a similar mass in topological B20 materials, the projected phonon density of states (DOS) of two atoms are mainly tuned within the frequency range below 200cm1 (RT thermal energy), leading to the increased total phonon DOS at RT related to EPI enhancement. In this study, focusing on topological B20-CoGe with Dirac-like and flat bands, where Co and Ge have similar masses, we demonstrate raising ESE in an epitaxial B20-CoGe thin film experimentally and theoretically. Although B20-CoGe is unstable under atmospheric pressure, the epitaxial growth of B20-CoGe thin films is achieved on Si substrates by the seed-assisted epitaxy method. The good agreement between experimental results and calculated S values with EPI is observed. The epitaxial B20-CoGe thin film shows the thermoelectric power factor of 5.8µWcm1K2, which is comparable to group IV element-based typical thermoelectric semiconductor thin films although B20-CoGe is a semimetal. Furthermore, the use of a heavier Ge atom resulted in lower thermal conductivity. The proposed strategy opens a new approach to realize a high thermoelectric performance (at RT) thin film on a Si platform.

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