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Retention or repulsion forces induced by bubbles trapped at the base of an immersed microparticle on a substrate
Phys. Rev. Fluids 9, 084301 – Published 2 August, 2024
DOI: https://doi.org/10.1103/PhysRevFluids.9.084301
Abstract
We explore the potential for air bubble entrapment beneath micrometer-sized particles following immersion. This investigation employs theoretical, numerical, and experimental methodologies, with a focus on the wetting characteristics of both the particle and its substrate. These properties are crucial in determining the likelihood of entrapment and its impact on the particle's adhesion force to the substrate. The theoretical model provides the mathematical framework to account for the additional force exerted on the particle due to the entrapped bubble, while numerical calculations yield corresponding force values. The results underscore the significant influence of the wettability of both the particle and the substrate on this force. In support of findings of the numerical model, companion experiments were performed. The results demonstrate that the bubbles can indeed be entrapped at microscales underneath micrometric particles. Experimental measurements of detachment force reveal the substantial impact of these entrapped bubbles on the force required to detach particles from a surface. Specifically, the force appears notably higher when either the particle or the substrate, or both, exhibit hydrophobic characteristics. We highlight the alignment observed between numerical calculations and experimental results, while also examining and discussing any identified disparities and their root causes. Lastly, we propose an energy model that predicts the post-detachment configuration of the bubble, determining whether it remains attached to the particle, adheres to the substrate, or splits into daughter bubbles distributed across both surfaces. These findings hold significance for a wide range of industrial applications where the immersion of micrometer-sized entities, such as dirt or bacteria, is common during liquid-based cleaning processes.
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