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Orthogonal liquid-jet impingement on wettability-patterned impermeable substrates

Uddalok Sen1, Souvick Chatterjee1, Julie Crockett2, Ranjan Ganguly3, Lisha Yu4, and Constantine M. Megaridis1,*

  • 1Department of Mechanical and Industrial Engineering, University of Illinois at Chicago, Chicago, Illinois 60607, USA
  • 2Department of Mechanical Engineering, Brigham Young University, Provo, Utah 84602, USA
  • 3Department of Power Engineering, Jadavpur University, Kolkata 700098, India
  • 4Corporate Research and Engineering, Kimberly-Clark Corporation, Neenah, Wisconsin 54956, USA

  • *cmm@uic.edu

Phys. Rev. Fluids 4, 014002 – Published 18 January, 2019

DOI: https://doi.org/10.1103/PhysRevFluids.4.014002

Abstract

Liquid-jet impingement on flat impermeable substrates is important for a multitude of applications ranging from electronic-equipment cooling to fuel atomization and erosion of solid surfaces. On a wettable horizontal surface, where a sufficient downstream liquid depth can be sustained after axisymmetric impingement, the jet forms a thin film on the substrate up to a radial distance where the film height suddenly increases, forming a hydraulic jump. On a superhydrophobic surface, where a downstream liquid depth is not naturally sustained, the thin film expands and breaks up into droplets, which are subsequently ejected in a random fashion outward, as carried by their radial momentum. In the present work, a facile, scalable, wettability-patterning approach is presented for delaying or even eliminating droplet breakup in the case of jet impingement on horizontal superhydrophobic surfaces. Analytical expressions for predicting the hydraulic jump and droplet breakup locations are developed to designate the proper wettability patterns that facilitate alteration and control of the postimpingement liquid behavior. The axisymmetric model is extended to evaluate the radial variation of the competing forces responsible for film breakup, and a design criterion for the effective wettability patterns is proposed.

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