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Micromachined Integrated Quantum Circuit Containing a Superconducting Qubit

T. Brecht*, Y. Chu, C. Axline, W. Pfaff, J. Z. Blumoff, K. Chou, L. Krayzman, L. Frunzio, and R. J. Schoelkopf

  • Department of Applied Physics, Yale University, New Haven, Connecticut 06511, USA and Yale Quantum Institute, Yale University, New Haven, Connecticut 06520, USA

  • *teresa.brecht@yale.edu

Phys. Rev. Applied 7, 044018 – Published 19 April, 2017Erratum Phys. Rev. Applied 8, 039902 (2017)

DOI: https://doi.org/10.1103/PhysRevApplied.7.044018

Abstract

We present a device demonstrating a lithographically patterned transmon integrated with a micromachined cavity resonator. Our two-cavity, one-qubit device is a multilayer microwave-integrated quantum circuit (MMIQC), comprising a basic unit capable of performing circuit-QED operations. We describe the qubit-cavity coupling mechanism of a specialized geometry using an electric-field picture and a circuit model, and obtain specific system parameters using simulations. Fabrication of the MMIQC includes lithography, etching, and metallic bonding of silicon wafers. Superconducting wafer bonding is a critical capability that is demonstrated by a micromachined storage-cavity lifetime of 34.3μs, corresponding to a quality factor of 2×106 at single-photon energies. The transmon coherence times are T1=6.4μs, and T2echo=11.7μs. We measure qubit-cavity dispersive coupling with a rate χqμ/2π=1.17MHz, constituting a Jaynes-Cummings system with an interaction strength g/2π=49MHz. With these parameters we are able to demonstrate circuit-QED operations in the strong dispersive regime with ease. Finally, we highlight several improvements and anticipated extensions of the technology to complex MMIQCs.

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Erratum

Erratum: Micromachined Integrated Quantum Circuit Containing a Superconducting Qubit [Phys. Rev. Applied 7, 044018 (2017)]

T. Brecht, Y. Chu, C. Axline, W. Pfaff, J. Z. Blumoff, K. Chou, L. Krayzman, L. Frunzio, and R. J. Schoelkopf
Phys. Rev. Applied 8, 039902 (2017)

Article Text

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