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Micromachined Integrated Quantum Circuit Containing a Superconducting Qubit
Phys. Rev. Applied 7, 044018 – Published 19 April, 2017Erratum Phys. Rev. Applied 8, 039902 (2017)
DOI: https://doi.org/10.1103/PhysRevApplied.7.044018
Abstract
We present a device demonstrating a lithographically patterned transmon integrated with a micromachined cavity resonator. Our two-cavity, one-qubit device is a multilayer microwave-integrated quantum circuit (MMIQC), comprising a basic unit capable of performing circuit-QED operations. We describe the qubit-cavity coupling mechanism of a specialized geometry using an electric-field picture and a circuit model, and obtain specific system parameters using simulations. Fabrication of the MMIQC includes lithography, etching, and metallic bonding of silicon wafers. Superconducting wafer bonding is a critical capability that is demonstrated by a micromachined storage-cavity lifetime of , corresponding to a quality factor of at single-photon energies. The transmon coherence times are , and . We measure qubit-cavity dispersive coupling with a rate , constituting a Jaynes-Cummings system with an interaction strength . With these parameters we are able to demonstrate circuit-QED operations in the strong dispersive regime with ease. Finally, we highlight several improvements and anticipated extensions of the technology to complex MMIQCs.
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Erratum
Erratum: Micromachined Integrated Quantum Circuit Containing a Superconducting Qubit [Phys. Rev. Applied 7, 044018 (2017)]
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References (34)
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